Advantages of SMT chip processing technology

1、 High reliability and strong vibration resistance

SMT chip processing uses chip like elements, which have high reliability and are small and light, thus having strong vibration resistance. It adopts automated production and has high mounting reliability. Generally, the defective solder joint rate is less than 10 parts per million, which is one order of magnitude lower than the through hole insertion component wave soldering technology. It can ensure that the solder joint defect rate of electronic products or components is low. Currently, almost 90% of electronic products use the SMT process.

2、 Electronic products have small size and high assembly density

The volume of SMT chip mounted components is only about 1/10 of that of traditional plug-in components, and the weight is only 10% of that of traditional plug-in components. Usually, using SMT technology can reduce the volume of electronic products by 40% to 60%, reduce the mass by 60% to 80%, and greatly reduce the area and weight occupied. The SMT chip processing and assembly component grid has developed from 1.27MM to 0.63MM grid, and some have even reached 0.5MM grid. By using through-hole installation technology to install components, the assembly density can be higher.

3、 Good high-frequency characteristics and reliable performance

Due to the firm installation of chip components, they are usually lead-free or short lead, reducing the impact of parasitic inductance and capacitance, improving the high-frequency characteristics of the circuit, and reducing electromagnetic and radio frequency interference. The circuit designed with SMC and SMD has a maximum frequency of 3GHz, while using chip components is only 500MHz, which can shorten the transmission delay time. Can be used in circuits with clock frequencies above 16MHz. If MCM technology is used, the high-end clock frequency of computer workstations can reach 100MHz, and the additional power consumption caused by parasitic reactance can be reduced by 2-3 times.

4、 Improve productivity and achieve automated production

At present, in order to achieve complete automation in the installation of perforated printed boards, it is necessary to expand the area of the original printed board by 40%, so that the insertion head of the automatic plug-in can insert the components. Otherwise, there is not enough space gap, which will damage the parts. The automatic placement machine (SM421/SM411) uses a vacuum nozzle to suction and discharge components. The vacuum nozzle is smaller than the component shape, which actually increases the installation density. In fact, both small components and fine pitch QFP devices are produced using automatic SMT machines to achieve full line automation.

5、 Reduce costs and expenses

(1) The usage area of printed boards is reduced, which is 1/12 of that of through-hole technology. If CSP installation is used, its area will also be significantly reduced;

(2) Reduce the number of drilled holes on the printed board, saving repair costs;

(3) Due to the improved frequency characteristics, the cost of circuit debugging is reduced;

(4) Due to the small size and light weight of chip components, packaging, transportation, and storage costs are reduced; The use of SMT chip processing technology can save materials, energy, equipment, manpower, time, etc., which can be reduced by 30% to 50%.