1. High density

When it comes to the design of mobile terminals, not saving a millimeter of space inside the casing can create huge value for terminal customers. By saving space, larger and higher resolution displays, larger capacity batteries, and more precise processors and components can be adopted. All of these can enhance the functionality of the device while improving the overall user experience.

The large-scale MIMO (Multi Variable Control System) antenna configuration and increasingly complex RF front-end will make RF lines occupy more space in 5G smart phones. Among other factors in the terminal, the processing power required to support massive 5G data may also affect battery capacity and geometric structure. In this way, despite the increase in input/output demand, the space available for PCBs in 5G mobile terminals will still be significantly reduced.

2. High frequency and high speed

With the advent of the 5G era, the significant change in circuit board performance is high-frequency and high-speed. Due to the use of higher frequencies in applications such as 5G and IOT, which have gradually increased from below 3GHz in the past to 6GHz or even 24-30GHz, stricter impedance control is required due to the higher inherent frequency of 5G. If not formed in extremely precise ways, the thinner circuitry of 5G PCBs may increase the risk of signal attenuation and reduce data integrity.

3. High fever

The signal transmission in a PCB involves "impedance" and "dielectric loss", which increase with the high-frequency or high-speed digitization and high-power of the signal, causing the PCB to continue heating and heating up. The first stage of China's 5G commercial frequency band is mainly concentrated below 6GHz, and the later stage will be as high as 24-30GHz. The 5G transmission rate will continue to increase while the data transmission volume will increase significantly. In addition to the emergence of 3D video, cloud games, wireless charging and other applications, these factors have led to a significant increase in the heat generation of 5G communication terminals compared to the 4G era.